SUNNYVALE, Calif., September 16, 2021–(BUSINESS WIRE)–Superior Semiconductor Engineering, Inc. (ASE), the main world supplier of semiconductor manufacturing companies in meeting and take a look at, right this moment introduced it was the recipient of the Cisco 2021 Excellence in Know-how Enablement Award. Cisco unveiled the award winners at its annual Provider Appreciation Occasion (SAE). The 30th annual SAE was aired nearly for the second yr in a row on Cisco TV on September 14, 2021.
This award acknowledges ASE for creating and delivering distinctive, distinctive know-how and/or worth proposition for Cisco, and persistently introducing rising or distinctive know-how to allow Cisco’s success.
“The best way we anticipate, navigate and reply to world occasions that affect our trade will decide how the world builds a extra sustainable, extra resilient, and extra inclusive future,” mentioned Marco De Martin, vice chairman, World Provider Administration, Cisco. “Our theme this yr, ‘Collectively Towards Tomorrow’ highlights the criticality of our prolonged accomplice and provider community. Regardless of the large challenges we confronted this previous yr, we now have collectively remained targeted on our shared targets. Along with our valued companions, we sit up for persevering with to assist our clients reimagine their functions, energy hybrid work, remodel their infrastructure and safe their enterprise.”
On the occasion, Cisco celebrated the collective achievements and contributions of its most strategic provide chain companions and acknowledged the suppliers and companions that executed exceptionally effectively throughout the provision chain.
About ASE, Inc.
ASE, Inc. is the main world supplier of semiconductor manufacturing companies in meeting and take a look at. Alongside a broad portfolio of established meeting and take a look at applied sciences, ASE delivers progressive superior packaging and system-in-package options to fulfill development momentum throughout a broad vary of finish markets, together with 5G, Synthetic Intelligence, Automotive, Excessive-Efficiency Computing, and extra. To find out about our advances in System-in-Bundle, Fanout, MEMS & Sensor, Flip Chip, and a pair of.5D, 3D and TSV applied sciences, all finally geared in the direction of functions to enhance life-style and effectivity, please go to: aseglobal.com.
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